CONNECTING INNOVATION AND EXPERTS

Substrate

Bed your ASIC onto a worthy substrate as this will contribute to the performance of the entire concept. Electrical characteristics, assembly yield and long-term reliability strongly depend on the attributes of the substrate, such as size, ball and bump pitch, stack-up, material set, Cu rouchness, routing density and many more. A rough plan and simulations will contribute to an increase of small first-time rights in each project.

Assembly

Mounting an ASIC onto a substrate or into a package is not just baking a cake. We may develop a suitable assembly concept by discussing general and particular details, such as: bonding type, package type, materials, peripheral conditions. Eventually faster and better to collaborate with experienced partners.

IP Service

Your core design is ready. Peripherals like interconnects are needed. There is a wide range of IP globally. Let's find a comprehensive portfolio and select the right parts. With proper interface adoption, SoC/MCM development and time-to-market can be enhanced and reduced.